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Solderable Finishes

SOLDERABLE FINISHES
SOLDERABLE FINISH TYPICAL USE THICKNESS
HOT AIR SOLDER LEVEL (63/37)
LEAD FREE H.A.S.L (SN100C)
IMMERSION SILVER
ENTEK HT PLUS
GENERAL PURPOSE
GENERAL PURPOSE
FLAT PAD FOR FINE PITCH DEVICES
FLAT PAD FOR FINE PITCH DEVICES
4 - 40 um
4-40 um
1-1.2um
(To follow)
IMMERSION TIN FLAT PAD FOR FINE PITCH DEVICES AND BACKPLANES 1 - 1.2 um
GOLD OVER NICKEL FLAT PAD FOR FINE PITCH DEVICES 0.08 - 0.12 um GOLD OVER 3-5 NICKEL
SOFT / PURE GOLD WIRE BONDING 0.1 - 1um OVER 3.75 - 6.75 NICKEL
HARD GOLD EDGE CONNECTORS
KEY PADS
2.5 um 
CARBON INK KEY PADS 10 - 25 um 

Wrekin circuits offer a wide range of finishes to suit all applications.

  • Can be used on all board types
  • Multiple solder operation
  • Ease of manufacture
  • Excellent shelf life (1 year)
  • Press fit technology compatible
  • Lead free